pcb inspection equipment
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FPD 130kV X Ray Inspection Machine do podgrzewacza kasetowego
Application Widely applied for BGA , CSP , Flip Chip, LED , Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X ...
5um SMT X Ray Sprzęt CNC Programowalny dla EMS BGA Voids
5um Microfocus X Ray Machine with CNC Programmable inspection For SMT EMS BGA Voids checking Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing ...
PCBA Micro Focus Pulpit X Ray Machine Intensifier FPD, pokrycie X-Ray 48mm X 54mm
Benchtop Electronics PCBA micro-focus BGA X Ray Inspection Machine OUR SERVICE 1.Your inquiry will be replied in 12 hours. 2.Original Manufacture to customers, with competitive price. 3.We provide one year warranty, free training and whole life technology support. 4.We can arrange the shipment by ...
Wysoka automatyka Bga X Ray Maszyna do wykrywania i analizy suchego stawu
Dry joint detection and analysis BGA X-Ray Inspection Machine X-ray inspection system has been widely applied to Circuit Board Inspection,Semi-Conductor Inspection and Other Applications. ( Offline X - Ray series ) widely used in offline detection, defect analysis, used for PCBA, packaging, ...
Elektronika kontrolna BGA PCB Maszyna rentgenowska Piłka golfowa Kontrola jakości
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection, Features Max. loading area φ570mm, max. inspection area ...
Analiza Inline SPC Electronics X Ray Machine LX2000 FPC do lutowania BGA QFN
Fully automatic Inspection and Analysing Inline AXI LX2000 X-ray for BGA , QFN soldering void inspection one FPC Technical Parameters and Specifications System Summary Footprint 2595(W)×1392(D)×1992(H)mm Machine Weight 1900 kg (X-Ray) / 700kg (Conveyor) Power Supply AC 110~220V, 50/60Hz Plywood ...
Certyfikowany przez CE/FDA system kontroli rentgenowskiej FPD 90KV do wykrywania wad kondensatorów
Wire Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment Description of IC X-Ray machine AX7900: Widely applied for BGA, CSP, PCB, Flip Chip, LED, Fuse, Diode, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovolta...
7μm obrazowanie IC Bonding przerwanie drutu Xray AX9100 UNICOMP sprzęt do testowania opakowań chipów półprzewodnikowych
7μm Imaging IC Bonding Wire Break Xray AX9100 UNICOMP Semiconductor Chip Packaging Testing Equipment Advanced X-ray inspection system designed for comprehensive defect detection in electronic components and industrial applications. Key Features 130KV 7μm X-Ray tube for precise imaging High speed & ...
Elektronika wysokiej rozdzielczości X Ray Machine, IC LED Clips Electronic Components Detector
IC LED Clips Electronic Components Detector Electronics X Ray Machine X-ray Inspecting Features:(1) Coverage of process defects up to 97%. Inspectible defects include: Empty solder, Bridge, Solder shortage, voids, components missing, and so on. In particular, the BGA, CSP and other solder joint ...
