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Tablice elektroniczne o wysokich parametrach Aparat rentgenowski 2D 2,5D Unicomp AX9100MAX ze stołem obrotowym 360 stopni
High Specifications Electronic Boards 2D 2.5D X-ray Machine Unicomp AX9100MAX 130KV micron focus spot size tube X-ray machine Unicomp AX9100 with dual computers for PCB BGA inspection. Optimized for high-precision non-destructive testing of semiconductors and electronics, the AX9100MAX provides comprehensive inspection capabilities for IC curvature measurement and various electronic components. Applications BGA, CSP, flip chips, LED packages Fuses, power diodes, multilayer
Półprzewodnikowa elektronika 110kV X Ray 5um AX8500 Do PCBA BGA
110kV 5um Microfocus X Ray Machine with high resolution FPD AX8500 For PCBA BGA void Inspection Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD)
Programowalna automatyczna kontrola CNC Elektronika Aparat rentgenowski Unicomp AX9100MAX do pomiaru krzywizny układu scalonego
CNC Programmable Automatic Inspection Electronics X-ray Machine Unicomp AX9100MAX Optimized for high-precision non-destructive testing of semiconductors and electronics, the AX9100MAX provides comprehensive inspection capabilities for IC curvature measurement and various electronic components. Applications BGA, CSP, flip chips, LED packages, fuses, power diodes, multilayer PCBs, discrete semiconductors, lithium battery modules, precision castings, automotive connectors,
Urządzenie rentgenowskie SMT PCB o wysokiej rozdzielczości mikronów, rozmiar plamki ogniskowej Unicomp AX9100MAX do pomiaru pustych przestrzeni BGA
SMT PCB X-ray Machine - Unicomp AX9100MAX High-resolution micron focus spot size X-ray system optimized for BGA voids measurement and comprehensive non-destructive testing of semiconductors and electronic components. Applications BGA, CSP, flip chips, LED packages, fuses, power diodes, multilayer PCBs, discrete semiconductors, lithium battery modules, precision castings, automotive connectors, wiring harnesses, and photovoltaic components. System Specifications Footprint1450
130KV mikronowa maszyna rentgenowska z wbudowaną kropką w celu kontroli PCB BGA
Unicomp AX9100MAX X-Ray Inspection System 130KV micron focus spot size tube X-ray machine with dual computers for high-precision PCB and BGA inspection. Optimized for non-destructive testing of semiconductors and electronics, providing comprehensive inspection capabilities for IC curvature measurement and various electronic components. Applications BGA, CSP, flip chips, LED packages, fuses, power diodes, multilayer PCBs, discrete semiconductors, lithium battery modules,
110 kV Inline X-ray Machine
Unicomp 110kV 30ppm & 60ppm Inline Xray machine for lithium cell automatically inspection with NG part auto-sorting Aftersales service: Ø A professional service team Ø Country-wide network Ø 24/7 hotline Ø Onsite installation, debugging and training services Ø Scheduled call & visits Ø Life-long free software upgrading Prodcution Capacity Ø Wuxi Factory: 6000M2 Ø Shenzhen Factory: 9000M2 Ø Chongqing Factory:8500M2 Ø Current Capacity: 300 Sets /Month Ø Expansion Capacity: 1000
AI Wysokiej Rozdzielczości PCBA BGA Unicomp X-ray AX7900 Urządzenie do Testowania Montażu SMT
Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment Description of X-Ray machine AX7900: Adopts high-performance 90kV micro-focus X-ray tube with 5μm focal spot and high-sensitivity FPD flat panel detector. Built with precision multi-axis XY motion platform, optional ±60° oblique viewing angle is available. Independent Z-axis adjustment for X-ray source and detector freely optimizes imaging magnification and detection field range.Precise optical point
Rurowe i żebrowe wymienniki ciepła oraz płytowe płyty grzewcze z cieczą chłodzącą NDT Rentgen UNICOMP UNC160
Tube and Fin Heat Exchangers and Plate Heat Liquid Cold Plates NDT X-ray UNICOMP UNC160 Product Description: Widely applied in industrial non-destructive testing, the UNICOMP UNC160 efficiently inspects metal castings, hardware, plastics, refractory materials, composites, ceramics and welded components for internal hidden defects. Features: Wide Application Range It features a large inspection area and heavy load capacity to adapt to various testing needs. Reliable Safety
Maszyna do kontroli rentgenowskiej Unicomp microfocus 2.5D AX7900 z widokiem ukośnym do kontroli pęknięć wiązek przewodów i kabli
Unicomp microfocus 2.5D X-ray inspection machine AX7900 with oblique view for Wire harness & cables cracks inspection Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines
