Elektronika X Ray Machine
Desktop Offline Maszyna rentgenowska w czasie rzeczywistym Wysoka precyzja dla komponentów elektronicznych
Desktop Offline Real Time X-Ray Machine High Precision For Electronics Components OUR SERVICE 1. Your inquiry will be replied in 12 hours. 2. Original Manufacture to customers, with competitive price. 3. We provide one year warranty, free training and whole life technology support. 4. We can arrange the shipment by air, DHL,Fedex, UPS, and by Sea,etc for you, and will give you the tracking NO. after shipment. 5. Well-trained and Professional after-sales service team to
Unicomp X-ray AX9100vs Wielowarunkowy 3D Mikrofokusowy System Inspekcji Analizacji Promieniowania X
Unicomp X-ray AX9100vs Multi-mode 3D Micro-focus X-ray Analyze Inspection System Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Precise detection inspection of tiny defects 2. Multi-mode 3D reconstruction 3. Synchronized 7-axis manipulation with any angle 4. Batch mode positioning inspection 5. Closed tube with maintenance-free X-ray source 6.
PCB SMT BGA LED Electronics X Ray Maszyna o dużej mocy X Ray Sources 100KV
PCB , SMT , BGA , LED Electronics X Ray Machine high power x-ray sources X-ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer. Applications: ● LED,SMT,BGA,CSP,Flip Chip Inspection. ● Semiconductor,Packaging
Wysokie specyfikacje płyty elektroniczne 2D i 2.5D X-Ray Machine Unicomp AX9100MAX z 360 stopniami obracającymi się stołem do inspekcji BGA i PCB
It enjoys broad utilization across diverse domains including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small-scale Metal Casting, Electronic Connector Modules, Cables, and the Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight
SMT PCB X-Ray Machine Unicomp AX9100MAX Wysokiej rozdzielczości Mikron Focus Spot Size dla BGA Voids i Inspekcji Pasty Lutowej
It finds extensive use in various fields including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, and Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption
Płyty elektroniczne 2D i 2.5D X-ray Machine AX9100MAX z 360 stopniami obracającym się stołem dla BGA&PCB
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
130KV Mikron Focus Spot Size Tube X-ray Machine AX9100MAX z podwójnymi komputerami do inspekcji PCB&BGA
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
Automatyczna kontrola programowana CNC Elektronika aparat rentgenowski AX9100MAX z kątem nachylenia 60° do pomiaru krzywizny IC
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
Maszyna rentgenowska PCB o wysokim powiększeniu Unicomp AX9100MAX do kontroli drutu wiązania komponentów elektronicznych IC
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
